Semiconductor Dedicated of Hydrostatic Wafer Grinder

Model number：GTR-1215

Characteristics

  • Won the 2023 Taiwan Excellence Award.
  • Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
  • Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
  • Chuck table could be customized according to the needs of different sizes wafers.
  • Achieve 300mm Si wafer thinning thickness <100μm, TTV <2μm, Ra 0.01μm
  • Especially designed for widely used in high hardness plane materials, rapid thinning, and achieve the effect of flattening.
  • Optional granite base.

Specification

Model Unit GTR-1215
Wheel Spindle
Spindle Type Hydrostatic
Spindle Accuracy (run-out) mm <0.001
Max. Wheel Spindle Speed rpm 0~3000
Grinding Wheel Size (Diameter) mm ?304
Rotary Table
Table Type Hydrostatic
Rotary Table Accuracy (run-out) mm 0.001
Speed of Rotary Table rpm 5~300
Max. Table Load kg 500
Vacuum Chuck Diameter mm 4"~12"
Rotary Table Diameter mm 12"
Auto Dressing System
Dressing Wheel Diameter mm ?150x?90x20T
Min. Feed-rate sec. 0.1μm
Other
Net/Gross Weight kg 2800/3200
Machine Size (LxWxH) mm 1872x1215x2380

Application

total Solution

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