{"id":3363,"date":"2023-05-22T14:07:54","date_gmt":"2023-05-22T14:07:54","guid":{"rendered":"https:\/\/www.grintimate.com\/?p=3363"},"modified":"2023-05-22T14:08:59","modified_gmt":"2023-05-22T14:08:59","slug":"grintimat-hydrostic-wafer-thinning-machine-awarded","status":"publish","type":"post","link":"https:\/\/www.grintimate.com\/?p=3363&lang=us","title":{"rendered":"Grintimat Hydrostic Wafer Thinning machine awarded"},"content":{"rendered":"\t\t
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Grintimat Hydrostic Wafer Thinning machine awarded <\/h3>

GTR-1215 also widely used to Silicon chips, ceramic substrate, packaging substrate, optical glass, sapphire substrate EMC, SIC and other non-metal, hard and agile material in Semi-Conductor industry. After 3 months and hundreds of scientist, industry experts\u2019 evaluation , The 2023 Taiwan Excellance awards finally announce the award winners. The long process to select the award winners is based on product design, quality, marketing and innovation\uff0ca total186 companies and 348 new products was selected,, among them, representing productivity and energy saving, was Grintimate\u2019s GTR series. Eg wafer thinning machine. This is the second time Grintimate awarded the title of Taiwan excellent since 2020\u3002\n\nGrintimate is the leading brand in Taiwan CNC grinding machine. With Their unique hydrostatic technology, they focus on providing the complete and best solution semi-conductor Industry- the sub-micron machining solution. The combination of Hydrostatic technology on grinding wheel, machine saddle and turn table gave birth new and revolutionary impact to not only in CNC machine tool industry but also semi-conductor machining\n\nThe warded GTR-1215Vertical Hydrostatic Wafer Thinning machine\u2019s two key components \u2013 wheel spindle and turn table are designed and features Grintimate\u2019s unique Hydrostatic technology. Not only the machine is highly accurate on rotation, but also high damping and high efficiency for wafer thinning.\n\nThe screen of GTR-1215 apply color touch screen with its own designed HMI (Human-Machine-Interface).is easy to operate, it will save the machining data in file. And monitoring grinding overload to automatically adjust grinding speed, in order to prevent workpiece broken due to overload cutting force. It can satisfy 8-15 inch wafer thinning.\n\nThe trend toward super high machine is not only on high machining efficiency but also high accuracy. Based on designer and manufacturer of hydrostatic spindle. The team of Grintimate successfully integrate the technology into machine, to provide high precision and efficiency, and eco-green machine tools for modern Industries.\n<\/p><\/p><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Link: https:\/\/www.chinatimes.com\/newspapers\/20221121000285-260210?chdtv<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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GTR-1215 also widely used to Silicon chips, ceramic substrate, packaging substrate, optical glass, sapphire substrate EMC, SIC and other non-metal, hard and agile material<\/p>\n","protected":false},"author":1,"featured_media":602,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[126],"tags":[],"class_list":["post-3363","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-en_media"],"yoast_head":"\nGrintimat Hydrostic Wafer Thinning machine awarded - \u5168\u946b\u7cbe\u5bc6\u5de5\u696d\u80a1\u4efd\u6709\u9650\u516c\u53f8<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.grintimate.com\/?p=3363&lang=us\" \/>\n<meta property=\"og:locale\" content=\"zh_TW\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Grintimat Hydrostic Wafer Thinning machine awarded\" \/>\n<meta property=\"og:description\" content=\"GTR-1215 also widely used to Silicon chips, ceramic substrate, packaging substrate, optical glass, sapphire substrate EMC, SIC and other non-metal, hard and agile material\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.grintimate.com\/?p=3363&lang=us\" \/>\n<meta property=\"og:site_name\" content=\"\u5168\u946b\u7cbe\u5bc6\u5de5\u696d\u80a1\u4efd\u6709\u9650\u516c\u53f8\" \/>\n<meta property=\"article:published_time\" content=\"2023-05-22T14:07:54+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-05-22T14:08:59+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.grintimate.com\/wp-content\/uploads\/2023\/02\/20221121.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1217\" \/>\n\t<meta property=\"og:image:height\" content=\"811\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"\u4f5c\u8005:\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"\u9810\u4f30\u95b1\u8b80\u6642\u9593\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 \u5206\u9418\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.grintimate.com\/?p=3363&lang=us\",\"url\":\"https:\/\/www.grintimate.com\/?p=3363&lang=us\",\"name\":\"Grintimat Hydrostic Wafer Thinning machine awarded - 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